Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission.

As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the CHSE (Cloud Hardware Systems Engineering) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for seasoned engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.

We are looking for a Hardware Engineer – PCB CAD to join the team.

• Working with internal teams including SI/PI, EE and Packaging to develop AI and Compute platform PCBs.
• Participating in the development of PCB stack-ups for high-performance designs.
• Executing routing studies to explore solutions for challenging high-speed and high-power designs.
• Developing foundational PCB routing and constraints for production board designs.
• Engaging with ODMs and fabs to ensure that PCBs are designed to the quality, reliability, supply chain and cost requirements of Microsoft Azure and the programs.
• Guiding ODM CAD resources to make designs fabrication-ready.
• Overseeing PCB designs through DRC and DFM verification processes, and resolving issues found during this process.

Required Qualifications:

• Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 2+ years technical engineering experience OR equivalent experience.

Other Requirements:

• Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to, the following specialized security screenings:
• Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud background check upon hire/transfer and every two years thereafter.

Preferred Qualifications:

• 3+ years of experience in PCB CAD for computer, FPGA and/or RF hardware designs.
• Expertise with Cadence Allegro, Altium and/or Mentor Xpedition.
• Experience with state-of-the-art PCB designs, including HDI via technology, high-layer counts, high-performance materials, etc.
• Experience with DRC/DFM checking and resolution of issues found through that process.
• Fundamental knowledge of Electromagnetic fundamentals and transmission line theory.
• Fundamental knowledge of CAD design for Signal Integrity and Power Integrity, including routing of high-speed interconnects from 25G to 224G+, and implementation of high-current power delivery networks.
• Strong written and verbal communication skills.
• Experience working across disciplines and organizations to resolve complex issues.
• Experience working with ODMs on execution of PCB CAD tasks.

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